AMD is slated to release its next-gen Zen 5 processors soon, with the Ryzen AI 300 and Ryzen 9000 rumored to arrive on July 15 and 31. However, some tech enthusiasts are excited about these new chips, especially as they’re the first in the Zen 5 family. Hardware tester David Huang got his hands on an engineering sample of the Ryzen AI 9 365, so he ran some quick benchmarks on the device and shared the results on his blog.
The platform he tested had 32 GB of LPDDR5x-7500 RAM, but he didn’t provide more information. Huang highlighted that the device is an engineering sample with early firmware, so the retail product’s performance could vary. Take the results with a pinch of salt.
Huang compared the Zen 5 chip’s performance with the previous generation Ryzen 7 7735U and Ryzen 7 7840U AMD chips. It consistently performed better in both Geekbench 5 and Geekbench 6 multi-core benchmarks, delivering 151.81% and 167.64% relative performance compared to the Ryzen 7 7735U. He also tested the chip using single-core benchmarks, and its Zen 5 and more efficient Zen 5c cores both showed a 15% minimum instructions per cycle uplift compared to the last-generation Ryzern 7 7735U.
These numbers align with the 16% IPC improvement AMD claimed for its Granite Ridge desktop processors. However, they’re slightly lower than the 20% higher CPU performance AMD claims for the Ryzen AI 300-series, but these tests do not include integrated GPU and NPU tests.
The performance improvement on the Zen 5 mobile chips might seem modest, but what makes it different from AMD’s last-generation processors is the use of a more powerful NPU that can hit up to 50 TOPS. While the Ryzen AI 300 PCs won’t come with Copilot+ features when it launches, it will eventually get them via a Windows Update later this year. Furthermore, apps that support on-device AI processing from AMD could already take advantage of the chip’s NPU.
These tests are from an engineering sample, so nothing is set in stone yet. Nevertheless, they are an indication of what we could expect from AMD’s next-generation processors, and we’d love to see how they’d perform in the real world. This is especially true as Microsoft and Qualcomm have just launched their Snapdragon X-powered Copilot+ PCs; we can’t wait to get our hands on both next-gen chips and run them head-to-head against each other.
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usertests 7735U is previous previous generation: Rembrandt (Zen 3). If Zen 5 is only 16% better than Zen 3, it's in trouble.
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Metal Messiah. However, they’re slightly lower than the 20% higher CPU performance AMD claims for the Ryzen AI 300-series, but these tests do not include integrated GPU and NPU tests.
Those were NOT claims made by AMD. That was a prediction made by the leaker "Golden Pig Upgrade" regarding MSI's Laptops which were showcased at Computex booth, and on top of that, these were early sample chips.
He also tested the chip using single-core benchmarks, and its Zen 5 and more efficient Zen 5c cores both showed a 15% minimum instructions per cycle uplift compared to the last-generation Ryzern 7 7735U.
Geekbench 5 and 6 delivered a 15% to 17% IPC uplift over the Ryzen 7 7735U.
You sure about that ? Shouldn't that IPC uplift be for the Ryzen 7 7840U, Zen 4 chip instead ?
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Metal Messiah. usertests said:
7735U is previous previous generation: Rembrandt (Zen 3). If Zen 5 is only 16% better than Zen 3, it's in trouble.I suppose that IPC uplift is against the Ryzen 7 7840U, Zen 4 chip. What do you think ?
But anyway, test system was running unofficial system firmware, and this was a very early engineering sample used. So the final silicon should perform much better than this.
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FunSurfer This IPC uplift in Zen 5 comes also with a lower power consumption, so together it is a substantial improvement.
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Metal Messiah. FunSurfer said:
This IPC uplift in Zen 5 comes also with a lower power consumption, so together it is a substantial improvement.Eh ? Not really. Because the Zen 3 and Zen 4 chips were running a 28W TDP, versus the 54W of the Ryzen AI 9 365 APU. So the power consumption values can't be directly correlated.
The test system was also running unofficial system firmware/software.
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Metal Messiah. Videocardz did a much better comparison, and it is more clear as well. And they have correctly used the Ryzen 7 7840U, Zen 4 chip as a reference.
https://videocardz.com/newz/amd-ryzen-ai-9-365-zen5-apu-tested-ahead-of-launch-ipc-uplift-measured
https://i.imgur.com/DDen75Z.pngReply
KnightShadey Was going to talk about not comparing apples to apples, but really as MM says still early firmware & software, there are some big (~30%) boosts Z4 to Z5 and some little ones, averaging tends to losing the weight vs the real world, even more-so with Spec. The notable thing is comparing Z3+ to Z5c which best illustrates where the areas where efficiency may be exploited.
Looking at the original blog ( https://blog.hjc.im/zen5-preliminary-review.html ) linked in the THG article and at the bottom of the VideoCardz artifle, some nice additional stuff including the TDP tests, intruction rate, and also inter-core latency.
The part that surprised me was the inter-core latencies seem very VERY high, even compared to designs that need to communicate between dies like 7950. You can see the very clear split between Z5 and Z5c and even within their groups it seems a bit high vs the Phoenix based 8700G.
Slower than the 2 separate low-power island efficiency cores on Meteor Lake (cores 20&21 on 155H grid), and also 6-8 of them being hamstrung vs just 2.This is an area I don't expect changing much over time, whereas the performance numbers above may get boost when accounting for improvements in firmware & software.
First grid & second grid from David Huang's blog, following latencies from Anand.
Compared to Phoenix desktop APU (couldn't find Ryzen mobile on Anand), Core 155H, and the BigBoy 7950X which has to communicate between dies.
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rtoaht That’s pretty bad. 7735U is a a Zen 3+ chip which is pretty much a rebranded 6800U. If that’s the IPC uplift for two generations combined then AMD is in trouble.
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